BBJconn AI Server High-Voltage DC Connection Module Deployed in South China Computing Center SMY-*1 Project

BBJconn AI Server High-Voltage DC Connection Module Deployed in South China Computing Center SMY-*1 Project

As the power density of AI servers continues to increase, data center power supply systems are upgrading towards higher voltage, higher current, and higher efficiency. As a key connection component in server power systems, high-voltage DC connection modules not only need to meet high current transmission requirements but also need to consider temperature rise control, operational safety, structural reliability, and long-term stability.

Recently, BBJconn Technology's AI server high-voltage DC connection module (AI server duckbill connector) completed application verification in the South China Computing Center SMY-*1 project. The product specifications used in this project reach 600A and 700V, designed to meet the power supply needs of high-power AI servers and computing infrastructure, providing a more stable and efficient DC power interconnection solution for high-density computing platforms.

600A High Current, Meeting the Power Supply Needs of High-Power AI Servers

AI servers are rapidly evolving ｆrom traditional computing platforms to high-density GPU computing platforms. The increase in the number of GPUs and the rise in overall power consumption necessitate that server power systems handle greater current and power.

The high-voltage DC connection module used in the SMY-*1 project at the South China Computing Center boasts rated parameters of 600A and 700V, providing high-current connection support for high-power, high-density server power supply scenarios.

Compared to ordinary power connection products, high-power AI server connection modules need to address key issues such as contact loss, temperature rise, and long-term operational reliability during high-current transmission. Therefore, the product design process requires comprehensive optimization across multiple dimensions, including conductive structure, contact system, heat dissipation path, mechanical structure, and temperature monitoring.

High-efficiency heat dissipation + temperature recognition enhances high-voltage connection reliability.

For 600A-level high-current connection systems, temperature control is a critical factor affecting long-term operational stability.

This AI server high-voltage DC module, while meeting high-current transmission requirements, further strengthens its heat dissipation design and is equipped with a temperature control and recognition module. This module can identify the temperature status during operation, providing support for monitoring the operation of high-power power supply systems.

Through the synergy of a high-current conductive structure, high-efficiency heat dissipation design, and a temperature recognition module, the product can better adapt to the long-term, high-load operating environment of AI servers.

This also signifies that AI server high-voltage connection products are gradually evolving ｆrom traditional connectors that simply handle "power transmission" to integrated, highly reliable power connection modules.

From 300A to 600A, continuously expanding AI server high-voltage connection capabilities

Previously, BBJconn's AI server high-voltage DC connection modules had already been validated and implemented in the Karamay X-1 project.

The recent adoption of 600A, 700V specifications in the South China Computing Center SMY-*1 project further demonstrates the company's ability to continuously iterate and customize products for different computing platforms and power supply architectures.

Currently, BBJconn is continuously advancing product development for AI server high-voltage power supply scenarios, offering different current levels, voltage platforms, and structural forms. Custom development can be tailored to customer server platforms, power supply architectures, installation space, and heat dissipation requirements.

From single connector products to high-voltage DC connection modules for complete power supply systems, product application scenarios are constantly expanding.

Multiple AI computing power projects are under continuous validation, not just one.

The successful implementation of a single project validates product capabilities; the ongoing progress of multiple projects better demonstrates a company's long-term ability to serve customers across the industry chain.

In addition to the already implemented Karamay X-1 project and the South China Computing Center SMY-*1 project, BBJconn Electronics currently has several other AI computing power and data center-related projects under continuous validation, including those related to domestic IT innovation.

Simultaneously, leveraging its industry chain partners and project support channels, the company's high-voltage DC connection products are also participating in project validation and product support for application scenarios in the industry chain, including those of NVIDIA, Delta, and Luxshare.

These projects cover different server platforms, power architectures, and application scenarios, providing crucial support for BBJconn Electronics to continuously accumulate product development, project validation, and application experience in the field of high-voltage power supply connections for AI servers.

Extending ｆrom high-voltage connections to AI server industry support

Focusing on the needs of the AI server industry chain, BBJconn Electronics has not limited its product portfolio to high-voltage DC connection modules but has continued to extend into power supply, heat dissipation, and precision structural components.

Current product portfolio includes:

High-voltage power supply: AI server high-voltage DC connection modules, duckbill DC connectors, AC power connectors, HV DC/AC high-voltage connection systems, etc.

Cooling: Liquid cooling products, air cooling products, cooling fans, heat sinks, etc.

Precision structural components: CNC precision machined parts, die-cast parts, stamped parts, cold-forged parts, and related structural components.

Through the collaborative development of connectivity, power supply, cooling, and structural components, we can further meet the needs of AI server customers shifting ｆrom single component procurement to a systematic supply chain support.

Continuing to deepen our expertise in the AI server high-voltage connectivity sector.

AI computing infrastructure is entering a new stage of high-power, high-density development, and server power systems will face greater technological challenges.

From the Karamay X-1 project to the South China Computing Center SMY-*1 project, and to multiple computing projects currently undergoing verification, BBJconn is continuously accumulating project experience in the field of AI server high-voltage power supply.

In the future, BBJconn Electronics will continue to focus its product development on high current, high voltage, high efficiency, and high reliability, continuously improving its AI server high-voltage DC connection module product system, and providing customized development and supporting services based on different customer platforms.

By driving technological iteration through project verification and testing product capabilities through large-scale applications, BBJconn Electronics will continue to deepen its expertise in the field of high-voltage power supply connections for AI servers and data centers, providing more stable, efficient, and reliable connection support for next-generation computing infrastructure.